ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,636, issued on March 25, was assigned to STAR MICRONICS Co. LTD. (Shizuoka, Japan). "Lathe with chuck" was invented by Takayuki Ishikawa (... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,977, issued on March 25, was assigned to Commvault Systems Inc. (Tinton Falls, N.J.). "Entropy-based ransomware detection" was invented by... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,495, issued on March 25, was assigned to SAINT-GOBAIN PERFORMANCE PLASTICS Corp. (Solon, Ohio). "Adhesive composition and methods of formi... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,262,186, issued on March 25, was assigned to Meyer Sound Laboratories Inc. (Berkeley, Calif.). "System and method for delivering full-bandwidt... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,256,949, issued on March 25, was assigned to Paragon 28 Inc. (Englewood, Colo.). "Intramedullary nail fixation guides, devices, and methods of... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,256,808, issued on March 25, was assigned to Boa Technology Inc. (Denver). "Lace coupling for reel based closure device" was invented by Thoma... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,260,541, issued on March 25, was assigned to MATERIALS ANALYSIS TECHNOLOGY INC. (Hsinchu County, Taiwan). "Soldering quality inspection method... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,257,963, issued on March 25, was assigned to General Electric Co. (Evendale, Ohio) and General Electric Deutschland Holding GmbH (Frankfurt, Ge... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,654, issued on March 25, was assigned to SUMITOMO ELECTRIC INDUSTRIES LTD. (Osaka, Japan). "Method for manufacturing semiconductor device"... Read More
ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,093, issued on March 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor packages having a dam struct... Read More